TSMC

TSMC was founded in Hsinchu Science Park, Taiwan by Morris Chang as the world's first dedicated semiconductor foundry, pioneering the pure-play foundry business model.

TSMC went public on the Taiwan Stock Exchange (TWSE: 2330), providing public capital to fund its aggressive fab expansion.

TSMC became the first Taiwanese company to be listed on the New York Stock Exchange (NYSE: TSM), opening the doors to international investors.

TSMC became the first foundry to deliver 0.13-micron copper interconnect technology, establishing its process leadership in the industry.

TSMC began manufacturing chips for Apple, starting with the A4 processor used in the iPhone 4 and iPad, beginning a partnership that would become one of the most important in the tech industry.

TSMC became the first foundry to mass-produce 7nm chips, used in Apple's A12 Bionic, AMD's Ryzen processors, and Nvidia's GPUs, cementing its process technology leadership.

Founder Morris Chang retired from TSMC after 31 years of leadership, with Mark Liu becoming Chairman and C.C. Wei becoming CEO.

TSMC became the first company to begin volume production of 5nm chips, powering Apple's A14 Bionic and M1 processors, maintaining its lead over competitors like Samsung.

TSMC announced plans to build a semiconductor fabrication facility in Phoenix, Arizona, its first advanced greenfield fab in the United States, with a USD 12 billion investment targeted at 5nm production by 2024. The move came amid US-China tech tensions and Washington's push to reshore chip manufacturing, and became the foundation for TSMC's later expanded multi-fab Arizona campus.

TSMC began high-volume manufacturing of 3nm (N3) semiconductor technology, becoming the first foundry in the world to commercialize 3nm fabrication. The advanced node delivered up to 15% faster speeds and 30% improved power efficiency over 5nm, powering Apple's A17 Pro and M3 chips and maintaining TSMC's process technology leadership over competitors Samsung and Intel.

TSMC's market capitalization surpassed $1 trillion for the first time, making it one of the most valuable companies in Asia and among the top 10 most valuable companies globally. The milestone reflected TSMC's critical role in the global semiconductor supply chain as the primary manufacturer of advanced chips for Apple, Nvidia, AMD, and Qualcomm, and its pricing power in an era of AI-driven chip demand.

TSMC's first advanced semiconductor fabrication facility in Arizona began chip production, marking a milestone in the company's global expansion and US semiconductor manufacturing efforts. The facility, part of a $40 billion investment, produces 4nm and 5nm process technology chips for American customers including Apple, AMD, and Nvidia. The Arizona fab represents the most advanced semiconductor manufacturing facility on US soil.

TSMC officially began volume production of its 2-nanometer (N2) process node in Q4 2025 at Fab 22 in Kaohsiung, Taiwan. The 2nm process is the most advanced semiconductor technology in production worldwide, offering significant improvements in transistor density and energy efficiency over the previous 3nm generation. The chips are designed to address the growing demand for energy-efficient computing in AI and mobile applications, with 2nm wafers costing nearly $30,000 each.

TSMC announced an additional USD 100 billion investment in its Arizona operations, bringing its total US commitment to USD 265 billion across 10 fabrication plants, 2 advanced packaging facilities, and an R&D center. The expansion adds four sub-2nm fabs to meet surging AI chip demand and represents the largest foreign direct investment in American history. Fab 21 achieved 92% yield rate on initial 4nm production.

Sony Semiconductor Solutions and TSMC executed a legally binding definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation, a joint venture in Koshi City, Kumamoto, Japan, for volume production of next-generation smartphone image sensors starting in 2029. Sony will be the sole controlling shareholder and plans to contribute approximately 465 billion yen, while TSMC plans cash contributions of approximately 282 billion yen, with Japanese government support under consideration. The deal deepens Sony's sensor manufacturing scale and extends TSMC's foundry role into a directly operated manufacturing hub on Japanese soil.

TSMC announce the completion of development of its A16 (1.6nm class) process node, marking the company's most advanced semiconductor manufacturing technology. The A16 node incorporates backside power delivery network technology that delivers a 10% speed improvement or 20% power reduction compared to the N2P (2nm) process. Mass production is scheduled for Q4 2026, targeting high-performance computing and AI accelerator applications. The milestone extends TSMC's process leadership as competitors Intel and Samsung work to close the gap. Nvidia's next-generation Feynman GPU architecture is expected to be among the first products to use the A16 node.

A topping-out ceremony was held for TSMC's semiconductor plant under construction in Dresden, Germany, indicating the fab is progressing on plan and within budget, according to the head of the joint venture leading the project. The structural milestone keeps TSMC's first European fab on track for production, a pillar of Europe's push for chip supply independence.